在半导体器件制造中,需将金属薄膜沉积到晶片上去,采用得比较早的方法是“蒸发”。蒸发是一种物理性气相淀积法。固体的金属靶由一块热板(“闪蒸”法)或一束从热丝气化的电子(“电子束”法)激发,产生的金属蒸气便淀积到固定在真空室行星传动夹具的晶片上。 In the manufacture of semiconductor devices, the metal film needs to be deposited on the wafer, using an earlier method of “evaporation.” Evaporation is a physical vapor deposition method. The solid metal target is excited by a hot plate (“flash” method) or a bundle of electrons vaporized from the hot filament (“electron beam” method) and the resulting metal vapor is deposited onto a stationary planetary carrier On the chip.