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几年来，由于解决了很多微电路封装限制（如电参数、管壳尺寸、重量和系统的可靠性），多芯片组件（MCM）取得了长足的进步。但在对MCM缺乏经验的情况下，成本继续是潜在用户首要关心的问题。广泛应用MCM的场合是消费类产品，在此，成本和尺寸是首先考虑的问题。特别提出的是叠层式MCM能满足这样的要求。叠层式多芯片组件（MCM－L）特殊的优点包含了低成本、大容量的基权制造、这一点，广泛地影响着现存的IC组装工艺。
Over the years, much progress has been made in multichip modules (MCMs) by addressing many of the limitations of microcircuit packages such as electrical parameters, package size, weight, and system reliability. However, in the absence of experience with MCM, cost continues to be a primary concern for potential users. The widespread use of MCM is for consumer products, where cost and size are the first considerations. In particular, laminated MCM can meet such requirements. The unique advantages of the stacked multichip module (MCM-L) include low-cost, high-volume, proprietary manufacturing, which has a wide range of implications for existing IC assembly processes.