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采用SEM和EBSD研究了电铸铜在不同温度退火后的微观组织、晶粒取向以及特殊晶界的变化规律。结果表明:电铸铜退火前组织细小,平均晶粒尺寸约为2μm,随退火温度的升高,晶粒逐渐增大,650℃退火后,平均晶粒尺寸达到9.6μm;电铸铜主要存在{110}、{001}、{111}三种织构,{110}织构组分含量最多,退火处理有利于形成{001}织构,随退火温度的升高,{110}、{111}织构逐渐减少;电铸铜中存在大量分布取向差为60°的∑3共格孪晶界,电铸完成后,{001}晶粒相对较大,并且周围∑3晶界较少;较低温度退火时,{001}晶粒由于自身晶粒之间晶界易迁移而长大,在650℃退火时,大尺寸的{001}取向晶粒吞并周围其它取向晶粒而长大。
SEM and EBSD were used to study the microstructures, grain orientations and special grain boundaries of the electroformed copper annealed at different temperatures. The results show that the microstructure of the electroformed copper before annealing is fine and the average grain size is about 2μm. With the increase of annealing temperature, the grain size increases gradually and the average grain size reaches 9.6μm after annealing at 650 ℃. The {110}, {001} and {111} textures have the largest content of {110} texture components. The annealing treatment favors the formation of {001} texture. } Texture decreases gradually. There are a large number of Σ3 coherent twin boundaries in the electroformed copper with a distribution orientation difference of 60 °. After the electroforming is completed, the {001} grains are relatively large and there are fewer Σ3 grain boundaries around them. When annealed at lower temperature, {001} grains grow up due to the easy migration of the grain boundaries between themselves. When annealing at 650 ℃, the larger grains of {001} grow up by swallowing other oriented grains around them.