最新的技术发展已对精密零件提出了新的要求。在电子工业、激光等领域需要不断提高零件尺寸和形状精度以及晶体结晶的完整性。对于集成电路基板的硅片,要达到1～2nm的粗糙度和无损伤表面,这就要进行原子级的研磨抛光。国外一些学者对于这种微小量破坏的可能性进行了探讨,提出了几种用新的原理进行超精密研磨的方法,简单介绍给作者。 The latest technological developments have put new demands on precision parts. In the electronics industry, lasers and other areas need to continuously improve the size and shape accuracy of parts and crystal crystal integrity. For the integrated circuit substrate of silicon, to achieve 1 ~ 2nm roughness and non-destructive surface, which will be the atomic level of polishing. Some foreign scholars on the possibility of such a small amount of damage were discussed, put forward several new methods for ultra-precision grinding, a brief introduction to the author.