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焊点形态参数直接影响ＳＭＴ焊点的可靠性。为了建立ＰＢＧＡ焊点形态参数与热疲劳寿命的关系，利用ＢＧＡ焊点成形软件得到焊点形态，采用ＰＢＧＡ阵列数学分析与关键焊点非线性有限元分析相结合的方法得到关键焊点内的最大总应变值，利用热疲劳寿命计算公式得到焊点的热疲劳寿命。通过分析和数据处理得到ＰＢＧＡ焊点形态参数与热疲劳寿命之间的关系曲线，并总结出焊点形态参数对热疲劳寿命的影响规律及它们的关系表达式。
Solder joint morphology parameters directly affect the reliability of SMT solder joints. In order to establish the relationship between the parameters of PBGA solder joint and the thermal fatigue life, BGA solder joint forming software was used to obtain the solder joint morphology. The combination of the PBGA array mathematical analysis and the critical joint nonlinear finite element analysis was used to obtain the maximum Total strain value, thermal fatigue life calculated using the formula to get the thermal fatigue life of solder joints. Through the analysis and data processing, the relationship curves between the shape parameters of PBGA solder joints and the thermal fatigue life are obtained, and the influence rules of the solder joint morphology parameters on the thermal fatigue life and the expressions of their relations are summarized.