在不久的将来,小型、轻便、廉价的微机电系统(MEMS)将成为军用设备中的普通装置。微机电系统的尺寸小,其特点是把机械或结构元件(如加速度计和微型反射镜)与电子装置(如微处理器和射频发生器)集成到一起,并利用微电子技术进行制造和封装。微机电系统的集成对象还包括流体、光学、电磁和静电系统。这种系统一般采用非常坚硬的晶体硅作材料,这种材料比大多数钢有着更高的断裂极限,而且密度低。 In the near future, small, lightweight and inexpensive MEMS will become common devices in military equipment. Microelectromechanical systems are small in size and feature the integration of mechanical or structural components such as accelerometers and micromirrors with electronic devices such as microprocessors and RF generators and the fabrication and packaging of microelectronic technology . Microelectromechanical systems integration also includes fluid, optical, electromagnetic and electrostatic systems. This system typically uses very hard crystalline silicon as a material, which has a higher fracture limit than most steels and has a low density.