本文就悬空型或薄衬底热释电器件,做了三维分布参数模型的分析,既考虑了温度的纵向扩散所引起的效果,又考虑了横向扩散所引起的效果,最后导出了响应度公式。本文的特点是导出了较严格的解析解,并用计算机作了模拟计算,画出了曲线,它对热释电晶片尺寸的设计,有一定的参考价值。 In this paper, the analysis of three-dimensional distribution parameter model is done for the suspended or thin-substrate pyroelectric devices, which not only considers the effect caused by longitudinal diffusion of temperature but also considers the effect caused by lateral diffusion. Finally, . The characteristic of this paper is to derive a more rigorous analytical solution, and to make a computer simulation of the calculation, draw the curve, it thermoelectric chip size design, have some reference value.