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本文介绍了一种（１００）硅片上的压阻型集成电路封装应力测试芯片的设计、制造、校准和应用测量情况．该应力测试芯片包含双极性４元素应力测试单元和偏轴３元素压阻系数校准单元．所用应力测试单元具有温度补偿、灵敏度高、抑制工艺对准误差的特点．采用四点弯曲法进行了硅压阻系数校准测量．采用其中一种应力测试芯片，测量了ＩＣ卡按ＩＳＯ７８１６－１标准规定的弯曲和扭曲情况下的芯片应力，发现：ＩＣ卡弯曲时主要受正应力，剪切应力较小；而扭曲时剪切应力较大，正应力较小
This article describes the design, manufacture, calibration, and application of a piezoresistive integrated circuit package stress test chip on (100) silicon. The stress test chip includes a bipolar 4-element stress test unit and an off-axis 3-element piezoresistive coefficient calibration unit. The stress test unit used has the characteristics of temperature compensation, high sensitivity and suppression of process alignment error. The four-point bending method was used to calibrate the piezoresistive coefficient of silicon. One of the stress test chips was used to measure the chip stress under the bending and twisting conditions of the IC card according to the ISO7816-1 standard. It was found that the IC card was mainly subjected to normal stress and shear stress when it was bent, Large stress, positive stress is smaller