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众所周知,半导体、计算机和信息通信构成了当代电子学的三大支柱。其中,半导体起着举足轻重的作用。 自集成电路出现以来,约每隔五年其集成规模由小规模分别达到了中规模、大规模和超大规模水平。尤其是,自1970年1K大规模出现以来其集成规模每一年约翻一番。这种发展速度也是前所未有的。从集成电路的发展可以看出,半导体在小功率方面,由晶体管分立器件向材料器件一体化的集成电路,进而向分系统的大规模,今后继续向硬件、软件一体化的超大规模方向发展。 随着微波通讯在民用化方面的发展,应用范围只限于军事方面的那些半导体微波器件更加受到重视。在此,所用材料大体以砷化镓为
As we all know, the semiconductor, computer and information communication constitute the three pillars of contemporary electronics. Among them, the semiconductor plays a decisive role. Since the advent of integrated circuits, their integration scale has reached medium-scale, large-scale and ultra-large scale by small scale in about every five years. In particular, the scale of its integration has nearly doubled each year since the large-scale emergence of 1K in 1970. This rate of development is unprecedented. From the development of integrated circuits, it can be seen that in the field of low power, semiconductors are integrated circuits that integrate transistors and discrete devices into materials and devices, and then proceed to the large scale of the subsystem and continue to develop in a very large scale integrating hardware and software in the future. With the development of microwave communication in the field of civilization, more and more attention has been paid to those semiconductor microwave devices whose application is limited to the military field. Here, the material used is generally gallium arsenide