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在同等工艺条件下制备了两个WC-8Co试样,其中一个经历了塑性变形处理,分别收集了两个试样表面的电子背散射衍射数据。像质图样显示塑性变形破坏了WC的架状结构。分别通过取向差角分布关系、取向差角-轴分布关系和单一截面五参数法分析了Σ2晶界(即90°/[1010]晶界)的分布情况。结果显示塑性变形过程将降低Σ2晶界的分布强度。通过单一截面五参数法,解析了Σ2晶界组分对材料性能影响的权重。Σ2晶界对材料性能的影响主要通过晶界的迁移性,具体表现为晶界的滑移机制和对粘结相渗透的抵抗力。相比Σ2倾斜晶界,Σ2扭转晶界对材料性能的影响占有优势。
Two WC-8Co samples were prepared under the same conditions. One of them underwent plastic deformation and the electron backscatter diffraction data of the two samples were collected. Image quality shows that the plastic deformation of the WC frame structure destroyed. The distribution of Σ2 grain boundaries (ie, 90 ° / [1010] grain boundaries) were analyzed by means of the distribution of orientation difference angle, the relationship between orientation difference angle and axis and the single-section five-parameter method. The results show that the plastic deformation process will reduce the Σ2 grain boundary distribution strength. Through the single-section five-parameter method, the weight of Σ2 grain boundary components on the material properties was analyzed. The effect of Σ2 grain boundary on the properties of the material mainly depends on the grain boundary migration, which is manifested as the slip mechanism of the grain boundary and the resistance to the penetration of the binder phase. The Σ2 twist grain boundary has an advantage over the material properties compared to the Σ2 slanted grain boundaries.