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矽统科技近期相继推出了支持 INTELSOCKET370构架 CFU 的 SiS630S、630E 和支持 AMD 系列 CPU 的 SiS730S 整合单芯片组。随着矽统科技(SiS)自有晶圆厂的全面量产,SiS 的产品与 INTEL 和 VIA 在芯片市场上已成鼎立之势。矽统科技预计于今年年底发布两款分别支持
SiS recently introduced the SiS630S, 630E, and SiS730S integrated single-chipsets that support the INTELSOCKET370 architecture CFU. With the SiS (SiS) its own full-scale wafer fab, SiS products and INTEL and VIA in the chip market has become the dominant position. SiS expects to release two separate support plans by the end of this year