Copper (Cu) ion releasing properties can influence the biocompatibility of these Cu-containing biomedical material and devices. In this study, the multianalytical characterization, corrosion resistance and Cu ions release of different Ti-Cu films were reported. Titanium (Ti)-xCu films with Cu contents ranging from 1.6 to 77 at.% were fabricated using a combination of direct current magnetron sputtering (DCMS) and high power impulse magnetron sputtering (HiPIMS). To perform a thorough multianalytical characterization, the films were systematically analyzed by X-ray diffraction (XRD), high-resolution tran mission electron microscopy (HRTEM) and scanning electron microscope (SEM).The corrosion resistance of films was studied by electrochemical measurements. To investigate the copper ions release behavior of films, Ti-Cu films were immersed in PBS for 30 min, and 1, 3, 7, 14, 28 days and then the immersing solution were detected by ICP-MS. The films with 5 at.% Cu show Ti crystalline phase. The crystalline phase of Ti and Cu is confirmed for the films with content of 16 and 38%Cu. The amorphous structure is evident for the films with the content of 55 and 65 at.% Cu. The polarization test results indicate that the Ti–xCu coated SS with lower Cu content (3 and 30 at.%) possess better corrosion resistance than uncoated SS. However, with the increases of Cu contents, the corrosion resistance decreased and the pure Cu coated SS surface showed the least corrosion resistance. It is clear that higher corrosion resistance of films results in the lower copper ion release rate. The Ti–xCu film with controlled copper release displays a promising candidate to deposit on the surfaces of blood contacting materials, such as implanted cardiovascular devices.