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低温共烧陶瓷(LTCC)是制作微波多芯片组件(MMCM)基板的理想材料。本文介绍了基于LTCC工艺的微波传输线、集成腔体、功分器和散热过孔的设计。对于多通道微波组件,采用带状传输线和腔体结构有利于实现通道间的高隔离度,集成功分器和浆料电阻有利于实现组件的小型化并可获得较好的微波性能,而矩阵散热过孔可以显著改善基板导热性能,满足小功耗器件的散热要求。
Low-temperature co-fired ceramics (LTCC) are ideal materials for making microwave multi-chip module (MMCM) substrates. This article describes the LTCC technology based on the microwave transmission line, integrated cavity, power splitter and thermal vias design. For multi-channel microwave components, the use of ribbon transmission lines and cavity structure is conducive to achieving high isolation between channels, integrated power splitters and slurry resistance is conducive to the miniaturization of components and get better microwave performance, and the matrix Cooling vias can significantly improve the thermal conductivity of the substrate to meet the cooling requirements of small power devices.