前言制版工艺在半导体器件、薄膜混合集成电路的研制和生产中,所处的位置相当重要。制版质量的好坏,直接影响着产品的性能和成品率,甚至是成败的关键。在半导体器件向大规模集成电路飞速发展的今天,使得对制版工艺的要求越来越高。薄膜混合集成电路近年来也在不断发展,一方面集成度在提高;另方面基片尺寸在增大,电阻、引线尺寸在缩小(宽度方面)。过去采用的金 Preface Plate making process In semiconductor devices, thin film hybrid integrated circuit development and production, the location is very important. Plate quality is good or bad, a direct impact on product performance and yield, or even the key to success. Today, the rapid development of semiconductor devices to large-scale integrated circuits, making the requirements of the plate-making process higher and higher. In recent years, thin film hybrid integrated circuits are also growing, on the one hand, the integration is improving; on the other hand, the size of the substrate increases, and the resistance and lead size are reduced (width). Gold used in the past