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本文在实验结果和俄歇能谱分析结果的基础上,分析了Cd在InSb中扩散时,形成表面合金球的因素,探讨了合金球形成机理。从扩散工艺的角度提出了减少或清除表面合金球措施。 Cd扩散后的InSb晶片表面上,经常发现一些球状的“鼓泡”(小丘),通常称为表面合金球,它的出现,影响了p—n结的平坦性,对光刻及其他工艺带来很多麻烦,并且最终影响器件性能。本文在实验结果和俄歇分析的基础上探讨表面合金球的形成原因。
Based on the experimental results and Auger spectrum analysis results, the factors that form the surface alloy balls when Cd diffuses in InSb are analyzed. The formation mechanism of the alloy balls is also discussed. From the point of view of diffusion process, measures to reduce or eliminate surface alloy balls are proposed. On the surface of Cd-diffused InSb wafers, some globular “bubbling” (hillocks), often called surface alloy balls, are often found on the surface of the CdS alloy. Its appearance affects the planarity of the p-n junction. For lithography and other processes Brought a lot of trouble, and ultimately affect device performance. In this paper, the experimental results and Auger analysis based on the discussion of the formation of surface alloy ball causes.