近年来,随着电子工业的迅速发展,电子元件也在不断革新。对制造电子元件的材料也提出更高的要求。为了降低成本、改进组装工艺、提高质量、增加产量,国外已广泛采用异型铜带(即一边厚,一边薄或多阶梯型的铜带)制造塑料封装(简称塑封)电子元件来代替旧式金属封装的半导体电子元件。塑封电子元件与金属封装元件相比较, In recent years, with the rapid development of electronic industry, electronic components are constantly innovating. The manufacture of electronic components of the material also put forward higher requirements. In order to reduce the cost, improve the assembly process, improve the quality and increase the output, exotic shaped copper tapes (that is, thin and multi-step copper tapes) are widely used in foreign countries to manufacture plastic packages (referred to as plastic packages) instead of the old metal packages Of semiconductor electronic components. Plastic electronic components and metal packaging components compared,