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基于盖革模式(GM)雪崩光电二极管(GM-APD)探测阵列,设计了一种可用于红外3D成像的高性能红外传感读出电路(ROIC).该电路系统主要由主动淬火电路(AQC)、时间数字转换电路(TDC)和其他时序控制电路3个模块组成.AQC与TDC共同构成像素电路,在其余模块的配合下,由AQC电路检测GM-APD传感器产生的电流信号,TDC电路进行光子飞行时间(TOF)的计量,并转换为数字信号输出,从而实现更好的噪声抑制,更高的探测灵敏度.该电路采用CSMC 0.5μm标准CMOS工艺流片,阵列规模为8×8,像元中心距离100μm,芯片测试结果表明,电路功能良好,在250 MHz时钟驱动下,芯片可达到1 ns的时间分辨率,该电路可用于面阵结构红外探测系统或焦平面阵列.
Based on the GM-APD detection array, a high-performance infrared sensor readout circuit (ROIC) designed for infrared 3D imaging is designed.The active laser is mainly composed of an active quench circuit (AQC ), Time digital conversion circuit (TDC) and other timing control circuit 3. AQC and TDC together constitute a pixel circuit, in cooperation with the remaining modules, the AQC circuit detects the current signal generated GM-APD sensor, TDC circuit Photon time of flight (TOF) measurement, and converted to digital signal output, in order to achieve better noise suppression, higher detection sensitivity.The circuit uses CSMC 0.5μm standard CMOS technology chip, the array size of 8 × 8, like The result shows that the circuit has a good function. The chip achieves a time resolution of 1 ns driven by a 250 MHz clock. The circuit can be used for an array structure infrared detection system or a focal plane array.