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采用电刷镀技术制备晶粒尺寸为26nm的纳米晶铜,利用X射线衍射仪和透射电子显微镜分析电刷镀纳米晶铜微观结构及显微组织。使用MTS试验机对电刷镀纳米Cu进行应变速率为1.04×10-6～3.0s-1的拉伸和压缩试验,并分析两种试验所得性能的差异及其中的相关性。结果表明,电刷镀纳米晶Cu有较好的综合性能。由于其具有均匀一致的晶粒尺寸和大角晶界,此电刷镀纳米晶Cu可以作为本征纳米晶Cu材料进行分析。
The nanocrystalline copper with the grain size of 26nm was prepared by brush plating technique. The microstructure and microstructure of the nanocrystalline copper coated brush were analyzed by X-ray diffraction and transmission electron microscopy. The tensile and compressive tests of brush-coated nano-Cu with a strain rate of 1.04 × 10-6 ~ 3.0s-1 were carried out by using the MTS tester. The differences between the two tests and their correlations were also analyzed. The results show that brush plating nanocrystalline Cu has better overall performance. Due to its uniform grain size and high-angle grain boundaries, this brush-coated nanocrystalline Cu can be analyzed as an intrinsic nanocrystalline Cu material.