利用表面机械研磨处理(SMAT)在纯铜表面制备出纳米结构表层,并对其表面进行了电镀镍处理,采用扫描电子显微镜分析了镍原子在纳米晶铜中的扩散行为。结果表明:表面纳米晶层内存在有大量非平衡态缺陷和晶界,尤其是三叉晶界数量增加,降低了镍原子扩散的激活能,提高了其扩散系数,从而加快了镍原子的扩散。 The nanostructured surface layer was prepared on the surface of pure copper by mechanical surface treatment (SMAT), and the surface of the nanostructured surface was treated by nickel electroplating. The diffusion behavior of nickel atoms in nanocrystalline copper was analyzed by scanning electron microscopy. The results show that there are a large number of non-equilibrium defects and grain boundaries in the surface nanocrystalline layer, especially increasing the number of trigeminal grain boundaries, reducing the activation energy of nickel atom diffusion, increasing its diffusion coefficient and accelerating the diffusion of nickel atoms.