采用淀积和腐蚀工艺来形成多平面引线的办法正在成为微电子学器件制作中关键的一环,在许多应用中替代多层印刷电路板以作为器件的互联。它可用作集成电路芯片上的互联引线,或者采用标准的集成单元来制作较大功能的部件(大规模集成),或者有助于设计复杂的集成单元,使尺寸缩小,成品率提高。该工艺也能用作玻璃或陶瓷衬底上的引线把所需功能的集成电路连结起来(混合中规模集成)。三层互联系统由三层彼此由绝缘层隔离的铝组成,而且腐蚀成所需的图形。腐蚀连接窗孔,穿透绝缘层将不同层的 The use of deposition and etching processes to form multi-planar leads is becoming a key element in the fabrication of microelectronic devices, replacing multi-layer printed circuit boards for interconnection of devices in many applications. It can be used as an interconnect pin on an integrated circuit chip, either using larger, integrated components for larger components (large scale integration), or designing complex integrated units with reduced size and yield. The process can also be used as a lead on glass or ceramic substrates to integrate integrated circuits of desired functionality (mixed-sized). The three-tiered interconnect system consists of three layers of aluminum separated from one another by an insulating layer and is etched into the desired pattern. Corrosion of the connecting window, through the insulating layer will be different layers