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一、引言金是最早使用外电源镀复的金属之一。大约在1805年由意大利的布鲁格奈特林首次实现了电镀金。1840年英国人艾肯顿申请了氰化镀金的专利。到了1924年金的电解精炼采用了盐酸槽液以及后来改进直流电叠加交流电之后,镀金才有了较大的发展。1929年贝克专利首次叙述了首饰镀金或金合金,接着热处理的加厚金合金镀层的生产。第二次世界大战期间,装饰镀金得到了发展。与此同时,雷达的发展要求以金镀层防止用作导电的银层的变色,以及24K工业加厚镀金要求的逐步增长,镀金在电子工业中的应用逐渐扩大。直到1950年以后,电子工业的迅速发展,金的用途迅速扩大,镀金工艺的研究才有了重大的发展。而在此之前,镀金主要应用于装饰领域。
First, the introduction of gold is the earliest use of external power plating complex one of the metal. Plating gold was first realized in about 1805 by the Brugge Knittlin in Italy. 1849 British Acton applied for cyanide gold plating patents. In 1924 gold electrolysis refining using hydrochloric acid bath and later improved DC superimposed alternating current, the gold plating have a greater development. The 1929 Baker Patent for the first time describes the production of jewelery gold or gold alloys, followed by heat-treated, thickened gold alloy coatings. During the Second World War, decorative gold plating has been developed. In the meantime, the development of the radar requires that gold plating be used to prevent discoloration of the silver layer used as the conductive layer and the gradual increase of the requirement of 24K industrial thickening gold plating. The application of gold plating in the electronics industry is gradually expanding. Until 1950, the rapid development of the electronics industry, the rapid expansion of the use of gold, the gold-plating process has made significant progress in the study. Prior to this, gold-plated mainly used in the field of decoration.